Tn 29 17 nand flash design and use considerations when dating

tn 29 17 nand flash design and use considerations when dating

NAND flash is distinguished by the series connection of cells along the .. TN Design and Use Considerations for NAND. Flash Memory. Reports of NAND flash device testing in the literature have for the most part been .. TN Design and Use Considerations for NAND. Flash Memory, flash drives use flash memory controllers designed to communicate with personal Use Considerations for. NAND. Flash Memory, Tn. 29 17 nand flash design and use considerations when dating - Navigation menu.

Flash memory

The most recent of these presents uFLIP [1], a bench- devices tested is cycles for all devices except the 8 Gbit MLC and 32 Gbit device, which are rated for cycles. In practice this degradation is compensated for by Additional work in this area includes [2] and [9].

If a cell has degraded too much, has focused primarily on energy usage and has not addressed however, the program or erase operation will terminate in performance or endurance. A pro- with a small number of outliers. Cell degradation implement the flash interface protocol for 8-bit devices; this of VT appears to be affecting the iterative programming and test setup may be seen in Figure 3.

Chips tested ranged erase algorithms here: A complete list of devices tested an aged block, requiring fewer steps of the iterative pro- may be seen in Table 1. In most cases a single sample of gramming cycle internal to the chip to reach the desired a chip was used; however multiple instances of the 16 Gbit programming level. Conversely, the erase response bottom and Mbit chips were tested.

Again, latency As blocks are repeatedly erased and programmed, the oxide was measured from the end of the command until the chip layer isolating the gate degrades, as described in more de- indicated data was ready, thus avoiding effects of varying tail in [5]. This in turn causes a change in the response of transfer speed. Write latency by device. Iterations 8 Figure 6: Wear-related changes in latency. Data points Specified are subsampled rather than averaged to illustrate the quantized 7 latency values due to iterative internal algorithms.

Erase latency by device. Read latency by device. Measured values were unaffected by access pattern or block wear. Virtually no variation within an erase block must be written sequentially to prevent was seen in measured values for each device. Note that specified program disturbs.

In effect the device is treated as a set of values were unavailable for the 8 Gb SLC and 16 Gb parts. We therefore tested non- average is reported for each chip. Results may be seen in sequential writes across different erase blocks; no detectable Figure 7, where measured speeds are compared to speeds difference in write performance was seen.

tn 29 17 nand flash design and use considerations when dating

Measured speeds the surprisingly high endurance of the devices tested is typ- under test conditions are seen to be somewhat better than ical, or is instead due to anomalies in the testing process. Due to the lifetime of a flash block, complicating the task of sum- the high variance of the measured endurance values, we have marizing our measurements. The best write performance is not collected enough data to draw strong inferences, and so obtained just before a block fails; however we hope to rarely report general trends instead of detailed results.

The slowest write performance Usage patterns: The results reported above were mea- occurs on fresh pages, but may speed up significantly after sured by repeatedly programming the first page of a block the first few hundred writes, leading to a sizable difference with all zeroes and then immediately erasing the entire between expected and worst-case performance.

Several devices were tested by writing to all pages To address this we report three values for both write and in a block before erasing it; endurance appeared to decrease erase: Ad- last erases, mean latency for the first operations on a ditional tests were performed with varying data patterns, block, and the best-case latency as seen by the first erases but no difference in endurance was detected.

Results are shown in Figures 8 and 9, again This result is not unexpected, as we surmise that one way compared to manufacturer specifications when available. We note that true random nal program or erase steps. Given some amount of variation writes are not possible on most flash devices, as the pages between cells, it is not unexpected that changing the state 1 Some test runs for the 4 Gbit device showed anomalously of a larger number of cells would result in a higher chance of long write and erase delays; these runs are excluded, and we failure as cells wear.

We note, however, that repeated erase are investigating their cause.

tn 29 17 nand flash design and use considerations when dating

We believe a deeper understanding Environmental conditions: The processes which re- on both sides, and focused experimentation, will help design sult in flash failure are exacerbated by heat [14], although higher-performance flash-based systems in the future.

However, at [1] L. We note that one of the primary differences between our [2] P.

tn 29 17 nand flash design and use considerations when dating

We are curious as Systems. Many of the results of these tests were expected: Trends in high-density program with one exception and erase times were for the flash memory technologies. Data retention The high endurance values measured—often nearly characteristics of sub nm NAND flash memory times higher than specified—were highly unexpected and cells. Further investigation is needed to de- Degradation of der typical system conditions, and whether any special care tunnel oxide by FN current stress and its effects on must be taken to achieve such behavior.

Ultra-low power data storage for sensor networks. Technical Note This has obvious applications in wear leveling algorithms, TN However, it also [9] K. Striegel, and has implications for block management on flash devices; if C.

Power and performance characteristics the latency of erasures can be hidden, then repeatedly re- of USB flash drives. However, if system performance is impacted by erase [10] M. The latency, wear should be distributed as evenly as possible in effect of negative VTH of NAND flash memory cells on order to avoid high end-of-life erase latencies. How sensitive [11] M. This, in turn, changes the drain-source current that flows through the transistor for a given gate voltage, which is ultimately used to encode a binary value.

The Fowler-Nordheim tunneling effect is reversible, so electrons can be added to or removed from the floating gate, processes traditionally known as writing and erasing. Over half the energy used by a 1. NOR flash continues to be the technology of choice for embedded applications requiring a discrete non-volatile memory device.

Erasing[ edit ] To erase a NOR flash cell resetting it to the "1" statea large voltage of the opposite polarity is applied between the CG and source terminal, pulling the electrons off the FG through quantum tunneling. The erase operation can be performed only on a block-wise basis; all the cells in an erase segment must be erased together. Programming of NOR cells, however, generally can be performed one byte or word at a time.

Compared to NOR flash, replacing single transistors with serial-linked groups adds an extra level of addressing. Bit-level addressing suits bit-serial applications such as hard disk emulationwhich access only one bit at a time. Execute-in-place applications, on the other hand, require every bit in a word to be accessed simultaneously. This requires word-level addressing.

Flash memory - Wikipedia

To read data, first the desired group is selected in the same way that a single transistor is selected from a NOR array. Next, most of the word lines are pulled up above the VT of a programmed bit, while one of them is pulled up to just over the VT of an erased bit.

The series group will conduct and pull the bit line low if the selected bit has not been programmed. Despite the additional transistors, the reduction in ground wires and bit lines allows a denser layout and greater storage capacity per chip.

The ground wires and bit lines are actually much wider than the lines in the diagrams. Manufacturers try to maximize the amount of usable storage by shrinking the size of the transistors. Writing and erasing[ edit ] NAND flash uses tunnel injection for writing and tunnel release for erasing. The architecture of NAND Flash means that data can be read and programmed in pages, typically between 4 KB and 16 KB in size, but can only be erased at the level of entire blocks consisting of multiple pages and MB in size.

When a block is erased all the cells are logically set to 1. Data can only be programmed in one pass to a page in a block that was erased. Any cells that have been set to 0 by programming can only be reset to 1 by erasing the entire block. This means that before new data can be programmed into a page that already contains data, the current contents of the page plus the new data must be copied to a new, erased page.

If a suitable page is available, the data can be written to it immediately. If no erased page is available, a block must be erased before copying the data to a page in that block. The old page is then marked as invalid and is available for erasing and reuse.

The vertical layers allow larger areal bit densities without requiring smaller individual cells. Such a film is more robust against point defects and can be made thicker to hold larger numbers of electrons.

Explain the Basics of the NAND Flash memory

V-NAND wraps a planar charge trap cell into a cylindrical form. A string is a series of connected NAND cells in which the source of one cell is connected to the drain of the next one.

Strings are organised into pages which are then organised into blocks in which each string is connected to a separate line called a bitline BL All cells with the same position in the string are connected through the control gates by a wordline WL A plane contains a certain number of blocks that are connected through the same BL.

An individual memory cell is made up of one planar polysilicon layer containing a hole filled by multiple concentric vertical cylinders. The hole's polysilicon surface acts as the gate electrode. The outermost silicon dioxide cylinder acts as the gate dielectric, enclosing a silicon nitride cylinder that stores charge, in turn enclosing a silicon dioxide cylinder as the tunnel dielectric that surrounds a central rod of conducting polysilicon which acts as the conducting channel. Next, the hole's inner surface receives multiple coatings, first silicon dioxide, then silicon nitride, then a second layer of silicon dioxide.

Finally, the hole is filled with conducting doped polysilicon. They offer comparable physical bit density using nm lithography but may be able to increase bit density by up to two orders of magnitude.

This generally sets all bits in the block to 1. Starting with a freshly erased block, any location within that block can be programmed. However, once a bit has been set to 0, only by erasing the entire block can it be changed back to 1. A location can, however, be rewritten as long as the new value's 0 bits are a superset of the over-written values.

For example, a nibble value may be erased tothen written as Successive writes to that nibble can change it tothenand finally Essentially, erasure sets all bits to 1, and programming can only clear bits to 0.

Other flash file systems, such as YAFFS2never make use of this "rewrite" capability -- they do a lot of extra work to meet a "write once rule". Although data structures in flash memory cannot be updated in completely general ways, this allows members to be "removed" by marking them as invalid.

This technique may need to be modified for multi-level cell devices, where one memory cell holds more than one bit. This prevents incremental writing within a block; however, it does help the device from being prematurely worn out by intensive write patterns. This effect is mitigated in some chip firmware or file system drivers by counting the writes and dynamically remapping blocks in order to spread write operations between sectors; this technique is called wear leveling.

Another approach is to perform write verification and remapping to spare sectors in case of write failure, a technique called bad block management BBM. For portable consumer devices, these wear out management techniques typically extend the life of the flash memory beyond the life of the device itself, and some data loss may be acceptable in these applications.

tn 29 17 nand flash design and use considerations when dating

For high-reliability data storage, however, it is not advisable to use flash memory that would have to go through a large number of programming cycles. This limitation is meaningless for 'read-only' applications such as thin clients and routerswhich are programmed only once or at most a few times during their lifetimes. This is known as read disturb.